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High-Performance, Low-Power & Reliable 3D Integrated Circuits - Ideal for AI, IoT & Advanced Computing Applications
$55.51
$100.94
Safe 45%
High-Performance, Low-Power & Reliable 3D Integrated Circuits - Ideal for AI, IoT & Advanced Computing Applications
High-Performance, Low-Power & Reliable 3D Integrated Circuits - Ideal for AI, IoT & Advanced Computing Applications
High-Performance, Low-Power & Reliable 3D Integrated Circuits - Ideal for AI, IoT & Advanced Computing Applications
$55.51
$100.94
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Description
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
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Reviews
*****
Verified Buyer
5
I saw this book at the Springer booth at DAC and immediately ordered it; as a scientific researcher and engineering educator, I immediately understood and appreciated its impact. The author is Dr. Sung Kyu Lim of Georgia Tech, and I have had the great honor of visiting his lab, the Georgia Tech Computer-Aided Design (GTCAD) Lab, last year in Atlanta. Sung Kyu is a very strong scientist who does very solid work. This book, at over five hundred pages and seventeen chapters, is a gift to the scientific and engineering community, and I will be studying it and referring to it for many years in my research. Lim has pioneered the development of 3D IC tools and techniques, and has taped-out cutting-edge, high-performance 3D IC chips in academia, which is an enormous achievement, given the manpower constraints of academia compared with industry. He has mentored numerous talented graduate students who have become leaders in their field. He has created tool flows that transform RTL to GDSII. Lim contributed greatly to the first tape-out of a 3D IC multi-project wafer sponsored by the DoD; this could never have been completed successfully without a very sophisticated tool chain. This book has been thoroughly proofread and has many worked design examples and numerous high-resolution color figures that tell a fascinating story of an emerging technology that offers great performance and power advantages over traditional 2D ICs, though there are significant technical challenges in terms of thermal management, floor planning, mechanical stress, yield, and cost, that are addressed thoroughly in this book. The computer-aided design of a traditional 2D chip is extremely complicated; 3D ICs are even more complicated and challenging. Lim's tool flow leverages existing 2D tools and combines them with new tools to create a 3D IC tool flow. There are many, many steps in the conversion from RTL to GDSII, such as IR-drop analysis, signal integrity analysis, design rule checking, etc., and this book explains the entire process from start to finish. This book tells an inspiring story based on many years of very solid scientific achievement and progress, and I am proud to own it.

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